Optimization of Ohmic Contact Metallization Process for AlGaN/GaN High Electron Mobility Transistor
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چکیده
Copyright 2013 KIEEME. All rights reserved. This is an open-access article distributed under the terms of the Creative Commons Attribution Non-Commercial License (http://creativecommons.org/licenses/by-nc/3.0) which permits unrestricted noncommercial use, distribution, and reproduction in any medium, provided the original work is properly cited. Optimization of Ohmic Contact Metallization Process for AlGaN/GaN High Electron Mobility Transistor
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Schottky-Drain Technology for AlGaN/GaN High-Electron Mobility Transistors Citation
In this letter, we demonstrate 27% improvement in the buffer breakdown voltage of AlGaN/GaN high-electron mobility transistors (HEMTs) grown on Si substrate by using a new Schottky-drain contact technology. Schottky-drain AlGaN/GaN HEMTs with a total 2-μm-thick GaN buffer showed a threeterminal breakdown voltage of more than 700 V, while conventional AlGaN/GaN HEMTs of the same geometry showed ...
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